Qualcomm Package EDA Senior Engineer in Taiwan

Job Description:

Job Id

E1965838

Job Title

Package EDA Senior Engineer

Post Date

08/09/2018

Company


Division

Qualcomm Technologies, Inc.


CDMA Technology at http://www.qualcomm.com/about/businesses/qct

Job Area

Engineering - Manufacturing/Quality/Other

Location

Taiwan

Job Overview

The Qualcomm Package Architecture and Design team is responsible for the architectural planning, physical implementation, electrical/thermal/logical/physical verification and tapeout of Qualcomm's IC packages. The team is looking for a programmer with experience applying scripting to automate and enhance the team's various functions; thereby increasing the team's pathfinding/design efficiency, improving the design accuracy and quality, and enhancing the team's data organization. A fast learner with a strong fundamental background in scripting is required to automate the wide variety of industry standard IC and package CAD tools used by the team. The ideal candidate should possess a can-do mentality and leverage an understanding of the package design methodology to proactively and creatively improve the package design process. As the Package Architecutre and Design team is an international team, good communication skills is vital to provide excellent EDA debug, support, and training.

Minimum Qualifications

  • Experience in applying scripting/programming to meeting the following electronic design automation needs: IC Package Design, IC Design, Logical Verification, Physical Verification, Revision Control, Library Management

  • Design and/or automation experience for Cadence SIP, Cadence Innovus, Mentor Xpedition, Zuken DesignForce, Valor, DRC/LVS

  • Scripting experience in TCL, PERL, Python, SKILL, GitHub, Visual Basic

  • Experience using and supporting Linux environments and LSF

  • Experience in programming debug, technical support and automation training

  • Excellent communication and interpersonal skills

  • Working knowledge of package design, package-silicon co-design methodologies

  • Working knowledge of electromagnetic modelling and simulation

  • Familiar with package design rules

  • Familiar with package assembly and substrate manufacturing processes

Preferred Qualifications

na

Education Requirements

Bachelor's Computer Engineering, Computer Science, Electrical Engineering

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.