Qualcomm IC Package Engineer (Senior to Staff level) in Taiwan

Job Description:

Job Id

E1965797

Job Title

IC Package Engineer (Senior to Staff level)

Post Date

08/12/2018

Company


Division

Qualcomm Technologies, Inc.


CDMA Technology at http://www.qualcomm.com/about/businesses/qct

Job Area

Engineering - Manufacturing/Quality/Other

Location

Taiwan

Job Overview

We are looking for a highly motivated packaging engineer capable of leading advanced package technology projects. You will be responsible for the development of leading edge package technologies for the mobile market and driving that innovation into high volume manufacturing at subcontract manufacturers. The position requires the ability to lead teams and solve complex technical problems in working with multiple assembly suppliers and communicating with US based teams. Some international travel will be required.

Minimum Qualifications

Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.

7+ years Hardware Engineering experience or related work experience.

Preferred Qualifications

  • Direct experience in package manufacturing, experience in technical project management, and working first-hand with semiconductor material suppliers.

  • Understanding industry packaging trends, end-user packaging considerations, and previous experience with high-end mobile consumer products.

  • Proficiency in statistical data analysis.

  • Six Sigma Green or Black belt a plus.

Education Requirements

Bachelor's degree in Mechanical or Materials Engineering or related discipline; advanced degree in Engineering a plus.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.