Qualcomm Senior Engineer/Project Manager Module Assembly and Packaging m/f - Munich, Germany in Munich, Germany

Job Description:

Job Id E1954768

Job Title Senior Engineer/Project Manager Module Assembly and Packaging m/f - Munich, Germany

Post Date 08/09/2017

Company-Division Qualcomm Technologies, Inc.

CDMA Technology at http://www.qualcomm.com/about/businesses/qct

Job Area Engineering - Hardware

Location Germany - Munich

Job Overview

  • Development of new module assembly and packaging processes and platforms

  • Managing of complex projects through the full process flow with all involved departments, suppliers and OSATs

  • Definition of design rules, improvement of quality, cost and yield for new and current production processes

  • Continuous improvement of process capabilities by use of SPC data and use of quality tools

  • Support projects of product development department and factory/OSATs in case of customer claims

Minimum Qualifications

  • Proven experience in project management and process / technology development

  • Deep experience with the processes SMD mounting, die and wire bonding, flip-chip bonding, molding

  • Experience with complex production equipment and lines, Material-scientific knowledge of metals, ceramics and plastics

  • Knowledge of statistical methods (SPC) and of electrical engineering, excellent English and MS Office skills required

  • Assertiveness, poise and ability to work in a team, willingness to travel required (China, Korea, USA)

Preferred Qualifications Additional Language skills would be considered a plus

Education Requirements Master degree in electronics engineering, material science, mechanical/production/micro systems engineering or physics


EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.